In an era of rapidly evolving technology, the semiconductor industry stands at the forefront of innovation. Semiconductors manage the flow of electricity through an intricate process of binding valence electrons from different atoms. Other elements are then introduced to the semiconductor, where electricity can flow throughout the circuit. These chips are responsible for operating most modern technology, like phones, digital cameras, computers, TV’s, and more.
Moore’s Law states that computing power doubles every two years, and better performance means smaller, more condensed semiconductors. Companies, like the Taiwan Semiconductor Manufacturing Company (TSMC), are planning to start production of the next smallest semiconductor, the 3nm chip, later in 2023.
Production of smaller, more advanced chips requires more precise measures. Due to their size, problems with machinery are almost inevitable. In this blog, we’ll discuss future plans for the semiconductor industry, what to be on the lookout for, and how Bilz’s AIS High Performance vibration isolation systems can help mitigate problems and improve performance.
What’s Next for the Semiconductor Industry?
TSMC had recently announced their plans to build a $40 billion factory, or fab, in Arizona. There, they’ll focus on producing 4nm chips, which are most commonly used in smartphones and some laptops. The company also plans to start production of 3nm chips at a second facility in 2026. Smaller chips are the primary focus in the semiconductor industry because they’re more cost efficient, use less heat, have more computing power, and operate at a higher speed since electricity travels a shorter distance.
Since Taiwan is the main producer of semiconductors worldwide, their expansion in Arizona can potentially help the United States become a bigger competitor in the industry and help reduce supply chain issues of chips. Additionally, over ten thousand high-tech jobs will be available to American citizens.
Other global storage giants, like Samsung, SK Hynix, and Micron, plan on mass producing DDR5 products (fifth generation double data rate). DDR5 memory chips are optimized for more complex data and have greater speed and capacity compared to DDR4. They can also travel up to a speed of 84 Gbps because they have double the number of banks.
Currently, demand for DDR5 is higher than supply because not many computer manufacturers have adopted this new piece of technology, and components to make these memory chips can be expensive. Because of this, global storage giants need to heavily rely on external resources, like vendors, who have reliable machinery to produce these semiconductors.
Problems in the Semiconductor Industry and How Bilz Can Help
With the production of smaller, more compact semiconductors, machinery is more susceptible to issues, like vibration. The largest manufacturers in the semiconductor industry, such as TSMC, are also having a more difficult time finding skilled workers, which can lead to machinery dysfunctions caused by poor maintenance.
In addition, manufacturing chip technology is beginning to slow down because chips are becoming so advanced with computing and graphic capabilities. These new advances are then leading to increased demand; however, technology businesses don’t have the supply to satisfy all of their customers.
At Bilz, we provide a solution that mitigates vibration issues caused by manufacturing smaller components for chips. As semiconductors advance and become more compact, like the 3nm chip, it’s important that machines are precise and are able to carry out the intricate designs of these semiconductors. Our AIS High Performance vibration isolation solutions protects vibration sensitive facilities from experiencing production issues, and allows them to successfully accomplish their tasks and meet demand.
Conclusion
As technology continues to advance, it’s important that manufacturers in the semiconductor industry are able to adapt to increased demand and have machinery capable of mass producing chips. With the expected mass production of 3nm and DDR5 chips, challenges related to precision are likely to become a major issue.
Bilz’s AIS High Performance anti-vibration solutions is an innovative approach to help semiconductor manufacturers develop chips with intricate designs. This will also help with the production of new technology, such as phones, laptops, and digital cameras, because manufacturers will now be able to make the components needed for these modern devices.
If you’re looking to take the next steps to becoming a more reliable semiconductor manufacturer, check out our AIS High Performance vibration isolation solutions found here.
